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Find a TenderRef 081169-2025
Sub-Micron Die Bonder
U
Contracting authorityUNIVERSITY OF SHEFFIELDPublished9 Dec 2025
LocationSheffield, UKE32, United Kingdom
Description
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
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